4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Die bond

Eugene Cloud

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High density semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Patent

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High density semiconductor package and method of fabrication

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
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Method and apparatus for image processing to detect changes...

Image analysis – Image compression or coding – Interframe coding
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