Hardware set for growth of high k and capping material films

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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Details

C438S680000, C438S510000, C257SE21170, C257SE21267, C257SE21311, C257SE21632

Reexamination Certificate

active

07816200

ABSTRACT:
The present invention generally includes a method and an apparatus for depositing both a high k layer and a capping layer within the same processing chamber by coupling gas precursors, liquid precursors, and solid precursors to the same processing chamber. By coupling gas precursors, liquid precursors, and solid precursors to the same processing chamber, a high k dielectric layer, a capping layer for a PMOS section, and a different capping layer for a NMOS may be deposited within the same processing chamber. The capping layer prevents the metal containing electrode from reacting with the high k dielectric layer. Thus, the threshold voltage for the PMOS and NMOS may be substantially identical.

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