Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
Reexamination Certificate
2011-08-02
2011-08-02
Zarneke, David A (Department: 2891)
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
Insulative material deposited upon semiconductive substrate
C438S591000, C438S622000, C438S641000, C257S396000, C257S405000, C257SE21013, C257SE21021, C257SE21168, C257SE21171, C257SE21197, C257SE21209, C257SE21396, C257SE27087, C257SE29302, C257SE21274
Reexamination Certificate
active
07989362
ABSTRACT:
Electronic apparatus and methods of forming the electronic apparatus include a hafnium lanthanide oxynitride film on a substrate for use in a variety of electronic systems. The hafnium lanthanide oxynitride film may be structured as one or more monolayers. Metal electrodes may be disposed on a dielectric containing a hafnium lanthanide oxynitride film.
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patent:
Ahn Kie Y.
Bhattacharyya Arup
Forbes Leonard
Micro)n Technology, Inc.
Schwegman Lundberg & Woessner, P.A.
Zarneke David A
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