Gate electrode structure

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C257S288000, C257S324000

Reexamination Certificate

active

08008155

ABSTRACT:
An electrode structure, e.g., a gate electrode for a transistor, includes: a volume of semiconductor material; a gate oxide on the semiconductor volume; a barrier layer, including silicon nitride, on the gate oxide layer; an adhesion layer on the barrier layer; and a metallic layer on the adhesion layer.

REFERENCES:
patent: 4833099 (1989-05-01), Woo
patent: 5834353 (1998-11-01), Wu
patent: 6486030 (2002-11-01), Gonzalez et al.
patent: 6613657 (2003-09-01), Ngo et al.
patent: 6858524 (2005-02-01), Haukka et al.
patent: 2002/0145161 (2002-10-01), Miura et al.
patent: 2003/0235083 (2003-12-01), Swift et al.
patent: 2005/0145896 (2005-07-01), Song et al.
patent: 2005/0205969 (2005-09-01), Ono et al.
patent: 2006/0118858 (2006-06-01), Jeon et al.
patent: 2007/0296026 (2007-12-01), Jeon et al.
patent: 2007/0298568 (2007-12-01), Mokhlesi
patent: 10-2001-0056787 (2001-07-01), None
patent: 10-2002-0056261 (2002-07-01), None
Korean Office Action dated Aug. 29, 2007 for corresponding Korean Application No. 10-2006-0068423.

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