Gas baffle and distributor for semiconductor processing chamber

Details Gas baffle and distributor for semiconductor processing chamber Gas baffle and distributor for semiconductor processing chamber

2006-11-28

2010-06-22

Zervigon, Rudy (Department: 1716)

Coating apparatus

Gas or vapor deposition

C156S345330, C156S345340

Reexamination Certificate

active

07740706

ABSTRACT:
Apparatus and methods for distributing gas in a semiconductor process chamber are provided. In an embodiment, a gas distributor for use in a gas processing chamber comprises a body. The body includes a baffle with a gas deflection surface to divert the flow of a gas from a first direction to a second direction. The gas deflection surface comprises a concave surface. The concave surface comprises at least about 75% of the surface area of the gas deflection surface. The concave surface substantially deflects the gas toward a chamber wall and provides decreased metal atom contamination from the baffle so that season times can be reduced.

REFERENCES:
patent: 4439401 (1984-03-01), Voll et al.
patent: 4588000 (1986-05-01), Malin et al.
patent: 5322567 (1994-06-01), Deaton et al.
patent: 5441568 (1995-08-01), Cho et al.
patent: 5624498 (1997-04-01), Lee et al.
patent: 5772771 (1998-06-01), Li et al.
patent: 5804259 (1998-09-01), Robles
patent: 5851294 (1998-12-01), Young et al.
patent: 5865896 (1999-02-01), Nowak et al.
patent: 5994662 (1999-11-01), Murugesh
patent: 6013155 (2000-01-01), McMillin et al.
patent: 6083344 (2000-07-01), Hanawa et al.
patent: 6143078 (2000-11-01), Ishikawa et al.
patent: 6170428 (2001-01-01), Redeker et al.
patent: 6217658 (2001-04-01), Orczyk et al.
patent: 6302965 (2001-10-01), Umotoy et al.
patent: 6335288 (2002-01-01), Kwan et al.
patent: 6383964 (2002-05-01), Nakahara et al.
patent: 6416823 (2002-07-01), Li et al.
patent: 6444039 (2002-09-01), Nguyen
patent: 6450117 (2002-09-01), Murugesh
patent: 6453992 (2002-09-01), Kim
patent: 6589610 (2003-07-01), Li
patent: 6596653 (2003-07-01), Tan et al.
patent: 6676760 (2004-01-01), Kholodenko et al.
patent: 6737812 (2004-05-01), Yuasa et al.
patent: 6786973 (2004-09-01), Strauch et al.
patent: 6800139 (2004-10-01), Shinriki et al.
patent: 6821910 (2004-11-01), Adomaitis et al.
patent: 6884296 (2005-04-01), Basceri et al.
patent: 6960262 (2005-11-01), Sasaki et al.
patent: 6989061 (2006-01-01), DeMent et al.
patent: 7105060 (2006-09-01), Shimogaki et al.
patent: 7183227 (2007-02-01), Rasheed et al.
patent: 7294207 (2007-11-01), Strauch et al.
patent: 7316761 (2008-01-01), Doan et al.
patent: 7510624 (2009-03-01), Liang et al.
patent: 2001/0033900 (2001-10-01), M'Saad et al.
patent: 2002/0039625 (2002-04-01), Powell et al.
patent: 2002/0187655 (2002-12-01), Tan et al.
patent: 2003/0159656 (2003-08-01), Tan et al.
patent: 2003/0177977 (2003-09-01), Strauch et al.
patent: 2004/0060514 (2004-04-01), Janakiraman et al.
patent: 2004/0126952 (2004-07-01), Gondhalekar et al.
patent: 2004/0231798 (2004-11-01), Gondhalekar et al.
patent: 2005/0000441 (2005-01-01), Kaeppeler et al.
patent: 2005/0218115 (2005-10-01), Lei et al.
patent: 2006/0048707 (2006-03-01), Lei et al.
patent: 2006/0075967 (2006-04-01), Lu et al.
patent: 2006/0130756 (2006-06-01), Liang et al.
patent: 2006/0196410 (2006-09-01), Hishitani et al.
patent: 2006/0196420 (2006-09-01), Ushakov et al.
patent: 2006/0196603 (2006-09-01), Lei et al.
patent: 2008/0121177 (2008-05-01), Bang et al.
patent: 2008/0121178 (2008-05-01), Bang et al.
patent: 2008/0124944 (2008-05-01), Park et al.
patent: 2008/0188087 (2008-08-01), Chen et al.
patent: 2008/0188090 (2008-08-01), Chen et al.
patent: 2009/0093129 (2009-04-01), Park et al.
patent: 702392 (1996-03-01), None
patent: 55-166926 (1980-12-01), None
patent: 2006-310481 (2006-11-01), None
patent: 2007-305890 (2007-11-01), None
patent: WO 2006/096674 (2006-09-01), None
Requirement for Restriction/Election of U.S. Appl. No. 11/564,167, mailed on Aug. 29, 2008, 6 pages total.
Non-Final Office Action for U.S. Appl. No. 11/016,166 mailed on Oct. 4, 2006; pp. 9.
Final Office Action for U.S. Appl. No. 11/016,166 mailed on May 3, 2007; 8 pages.
Non-Final Office Action for U.S. Appl. No. 11/016,166 mailed on Oct. 17, 2007; 8 pages.
Final Office Action for U.S. Appl. No. 11/016,166 mailed on Jun. 9, 2008; 8 pages.
Notice of Allowance for U.S. Appl. No. 11/016,166 mailed on Nov. 25, 2008; 11 pages.
Non-Final Office Action for U.S. Appl. No. 11/075,527 mailed on Jan. 12, 2007; 20 pages.
Final Office Action for U.S. Appl. No. 11/075,527 mailed on Aug. 9, 2007; 17 pages.
Non-Final Office Action for U.S. Appl. No. 11/075,527 mailed on Jan. 15, 2008; 17 pages.
Final Office Action for U.S. Appl. No. 11/075,527 mailed on Aug. 6, 2008; 18 pages.
Non-Final Office Action for U.S. Appl. No. 11/075,527 mailed on Oct. 30, 2008; 17 pages.
Final Office Action for U.S. Appl. No. 11/075,527 mailed on Apr. 29, 2009; 18 pages.
Non-Final Office Action for U.S. Appl. No. 11/075,527 mailed on Oct. 14, 2009; 22 pages.
Notice of Allowance for U.S. Appl. No. 11/075,527 mailed on Mar. 10, 2010; 6 pages.
Non-Final Office Action for U.S. Appl. No. 11/564,105 mailed on Jul. 10, 2008; 11 pages.
Final Office Action for U.S. Appl. No. 11/564,105 mailed on Jan. 8, 2009; 12 pages.
Non-Final Office Action for U.S. Appl. No. 11/564,122 mailed on Jan. 6, 2010; 20 pages.
Non-Final Office Action for U.S. Appl. No. 11/564,167 mailed on Dec. 16, 2008; 15 pages.
Non-Final Office Action for U.S. Appl. No. 12/253,687 mailed on Dec. 31, 2009; 9 pages.
International Search Report for PCT/US2006/008003 mailed on Jun. 28, 2006; 3 pages.
Written Opinion Report for PCT/US2006/008003 mailed on Jun. 28, 2006; 6 pages.

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