Formation of circuitry with modification of feature height

Details Formation of circuitry with modification of feature height Formation of circuitry with modification of feature height

2004-10-06

2008-12-09

Malsawma, Lex (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257SE23021

Reexamination Certificate

active

07462936

ABSTRACT:
A connection component for mounting a chip or other microelectronic element is formed from a starting unit including posts projecting from a dielectric element by crushing or otherwise reducing the height of at least some of the posts.

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