Formation of a disposable spacer to post dope a gate conductor

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S592000

Reexamination Certificate

active

10752386

ABSTRACT:
A method of forming a doped gate structure on a semiconductor device and a semiconductor structure formed in that method are provided. The method comprises the steps of providing a semiconductor device including a gate dielectric layer, and forming a gate stack on said dielectric layer. This latter step, in turn, includes the steps of forming a first gate layer on the dielectric layer, and forming a second disposable layer on top of the first gate layer. A fat spacer is formed round the first gate layer and the second disposable layer. The second disposable layer is removed, and ions are implanted in the first gate layer to supply additional dopant into the gate above the gate dielectric layer, while the fat disposable spacer keeps the implanted ions away from the critical source and drain diffusion regions.

REFERENCES:
patent: 5168072 (1992-12-01), Moslehi
patent: 6489207 (2002-12-01), Furukawa et al.
patent: 6531365 (2003-03-01), Dokumaci et al.
patent: 6534351 (2003-03-01), Muller et al.
patent: 2004/0124450 (2004-07-01), Yeap et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Formation of a disposable spacer to post dope a gate conductor does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Formation of a disposable spacer to post dope a gate conductor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Formation of a disposable spacer to post dope a gate conductor will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3834316

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.