4. Illumination
  5. Edge lighted panel
  6. Housing

Chi-Hao Chiu

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Backlight module

Illumination – Edge lighted panel – Housing
Reexamination Certificate

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Backlight module

Illumination – Edge lighted panel – Housing
Reexamination Certificate

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Flip chip package and manufacturing method thereof

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Flip-chip type quad flat package and leadframe

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor
Reexamination Certificate

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Manufacturing method of flip chip package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
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Profile ID: LFUS-PAI-P-2393353

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