Flip chip package process

Details Flip chip package process Flip chip package process

2008-09-24

2009-11-10

Lindsay, Jr., Walter L (Department: 2812)

Electrical connectors

With circuit conductors and safety grounding provision

Grounding of coupling part

C438S112000, C438S124000, C438S127000, C257S778000, C257SE21503, C257SE21511

Reexamination Certificate

active

07614888

ABSTRACT:
A flip chip package process is provided. First, a substrate strip including at least one substrate is provided. Next, at least one chip is disposed on the substrate, and the chip is electrically connected to the substrate. Then, a stencil having at least one opening and an air slot hole is disposed on an upper surface of the substrate strip, an air gap is formed between the stencil and the substrate strip, the air gap connects the opening and the air slot hole, and the chip is located in the opening. Finally, a liquid compound is formed into the opening of the stencil to encapsulate the chip, and a vacuum process is performed through the air slot hole and the air gap, so as to prevent the air inside the opening from being encapsulated by the liquid compound to become voids.

REFERENCES:
patent: 6667124 (2003-12-01), Suenaga et al.
patent: 7481641 (2009-01-01), Fuergut et al.
patent: 2005/0224953 (2005-10-01), Lee et al.
patent: 2008/0187615 (2008-08-01), Gao et al.
patent: 2009/0026656 (2009-01-01), Bautista et al.

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