4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Entirely of metal except for feedthrough

Jen-Chieh Kao

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Flip chip package process

Electrical connectors – With circuit conductors and safety grounding provision – Grounding of coupling part
Reexamination Certificate

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Microsystem package structure

Optical: systems and elements – Optical modulator – Light wave temporal modulation
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Mold and method of molding semiconductor devices

Plastic and nonmetallic article shaping or treating: processes – Mechanical shaping or molding to form or reform shaped article – To produce composite – plural part or multilayered article
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Optical component package and packaging including an optical...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate

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Thermally enhanced package structure

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
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Profile ID: LFUS-PAI-P-2743437

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