4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Of specified configuration

Patent Law Group

Law Firm

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Anti-slip overshoe

Boots – shoes – and leggings – Antislipping devices – String type
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Bonding tool for mounting semiconductor chips

Metal working – Method of mechanical manufacture – Electrical device making
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Bump-on-lead flip chip interconnection

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead
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Bump-on-lead flip chip interconnection

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
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Chip scale package having flip chip interconnect on die paddle

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor
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