Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2006-05-15
2010-06-15
Lee, Hsien-ming (Department: 2823)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S126000, C438S127000, C257S778000, C257SE21503, C257SE21506
Reexamination Certificate
active
07736950
ABSTRACT:
Methods for forming flip chip interconnection, in which the bump interconnect is defined at least in part by an underfill. The underfill includes a material that is thermally cured; that is, raising the temperature of the underfill material can result in progressive curing of the underfill through stages including a gel stage and a fully cured stage. According to the invention, during at least an early stage in the process the semiconductor chip is carried by a thermode, which is employed to control the temperature of the assembly in a specified way. Also, flip chip interconnections and flip chip packages made according to the methods of invention.
REFERENCES:
patent: 6495397 (2002-12-01), Kubota et al.
patent: 6798072 (2004-09-01), Kajiwara et al.
Karnezos Marcos
Kim Kyung-Moon
Lee Koo Hong
Lee Moon Hee
Pendse Rajendra D.
Atkins Robert D.
Lee Hsien-ming
STATS ChipPAC Ltd.
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