Flip-chip connecting type semiconductor device

Details Flip-chip connecting type semiconductor device Flip-chip connecting type semiconductor device

1996-01-03

1998-09-29

Ostrowski, David

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

257691, 257737, 257773, 257786, H01L 2348, H01L 2352

Patent

active

058148914

ABSTRACT:
A plurality of bumps formed of low melting metal are disposed on the surface of the peripheral portion of a semiconductor substrate. Those bumps which are included in the above bumps and formed on each corner portion of the semiconductor chip are connected to a power supply wiring and a ground wiring used as a power supply wiring. The other bumps disposed in position other than the corner portions are connected to a signal wiring.

REFERENCES:
patent: 4338621 (1982-07-01), Braun
patent: 4930002 (1990-05-01), Takenaka et al.
patent: 4994902 (1991-02-01), Okahashi et al.
patent: 5089881 (1992-02-01), Panicker
patent: 5386129 (1995-01-01), Koizumi
patent: 5440453 (1995-08-01), Cooke et al.

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