Fingerprint sensor apparatus and manufacturing method thereof

Details Fingerprint sensor apparatus and manufacturing method thereof Fingerprint sensor apparatus and manufacturing method thereof

2007-03-20

2007-03-20

Everhart, Caridad (Department: 2891)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C438S124000, C257S680000, C257SE29324, C382S124000

Reexamination Certificate

active

10289268

ABSTRACT:
A fingerprint sensor apparatus can provide a normal fingerprint sensor function even when a mold flash is formed. The fingerprint sensor apparatus recognizes a pattern of a fingerprint by being contacted by a finger. A semiconductor chip has a surface on which a sensor part is formed. The semiconductor chip is encapsulated by a seal resin. The sensor part is exposed in a bottom of an opening formed in the seal resin part. A distance between an edge of the bottom of the opening and an edge of the sensor part is 0.3 mm to 0.1 mm.

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