4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Bump leads

Fumihiko Taniguchi

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Acceleration sensor, an acceleration detection apparatus,...

Measuring and testing – Speed – velocity – or acceleration – Acceleration determination utilizing inertial element
Reexamination Certificate

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Ceramic laminated device, communication equipment and method...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

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Fingerprint sensor apparatus and manufacturing method thereof

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive
Reexamination Certificate

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Method of fabricating semiconductor having through hole

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate

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Method of fabricating semiconductor having through hole

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Patent

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Profile ID: LFUS-PAI-P-398625

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