4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Metallic housing or support

Michio Hayakawa

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Fingerprint sensor apparatus and manufacturing method thereof

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive
Reexamination Certificate

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Process for manufacturing a packaged semiconductor having a divi

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Patent

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Semiconductor device and lead frame therefore

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough
Patent

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Semiconductor device and method of producing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1364505

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