Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Patent
1999-01-19
2000-12-05
Kelly, C. H.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
430316, 438723, 216 43, 216 47, 216 41, G03C 500, H01L 21302, B44C 122
Patent
active
061564850
ABSTRACT:
A method of high aspect ratio etching (HARE) of metal layers in quarter micron technology is disclosed. High aspect ratio patterns are encountered because of the shrinking lateral dimensions over the constant remaining thickness of the features of ultra large scaled integrated chips. HARE is accomplished by employing a tungsten W-hardmask with a high selectivity of 10:1 with respect to the immediately underlying aluminum-copper metal layer. In order to protect the lithographic integrity, overlying organic BARC is used to prevent reflections from the W-hardmask as well as from the underlying metal layer. The lithographic resolution is further improved by using a thin photoresist layer in combination with the high selectivity hardmask. In this manner, the tradeoff that normally has to be made between a high resolution process and a reliable metal etch is circumvented.
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Huang Cheng-Hao
Hung Chih-Shen
Tang Wen-Hsiang
Wang Yi-Fei
Ackerman Stephen B.
Kelly C. H.
Saile George O.
Taiwan Semiconductor Manufacturing Company , Ltd.
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