Semiconductor device manufacturing: process – With measuring or testing
Reexamination Certificate
2007-01-09
2007-01-09
Mills, Gregory (Department: 1765)
Semiconductor device manufacturing: process
With measuring or testing
C438S692000
Reexamination Certificate
active
09943955
ABSTRACT:
A method of controlling surface non-uniformity of a wafer in a polishing operation includes (a) providing a model for a wafer polishing that defines a plurality of regions on a wafer and identifies a wafer material removal rate in a polishing step of a polishing process for each of the regions, wherein the polishing process comprises a plurality of polishing steps, (b) polishing a wafer using a first polishing recipe based upon an incoming wafer thickness profile, (c) determining a wafer thickness profile for the post-polished wafer of step (b), and (d)calculating an updated polishing recipe based upon the wafer thickness profile of step (c) and the model of step (a) to maintain a target wafer thickness profile. The model can information about the tool state to improve the model quality. The method can be used to provide feedback to a plurality of platen stations.
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patent
Prabhu Gopalakrishna B.
Schwarm Alexander T.
Shanmugasundram Arulkumar P.
Applied Materials Inc.
Mills Gregory
Umez-Eronini Lynette T.
Wilmer Cutler Pickering Hale & Dorr
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