Stackable layer containing ball grid array package

Details Stackable layer containing ball grid array package Stackable layer containing ball grid array package

2011-07-19

2011-07-19

Clark, Jasmine J (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S693000, C257S686000, C257S700000, C257S734000, C257S773000, C257SE25006, C257SE25013, C257SE25021, C257SE25027, C257SE23061

Reexamination Certificate

active

07982300

ABSTRACT:
Layers suitable for stacking in three dimensional, multi-layer modules are formed by interconnecting a ball grid array electronic package to an interposer layer which routes electronic signals to an access plane. The layers are under-filled and may be bonded together to form a stack of layers. The leads on the access plane are interconnected among layers to form a high-density electronic package.

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