Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified configuration
Inventor
active
Ball grid array integrated circuit package that has vias located
Ball grid array integrated circuit package that has vias located
Cavity mold cap BGA package with post mold thermally conductive
Corner heat sink which encloses an integrated circuit of a ball
Custom corner attach heat sink design for a plastic ball grid ar
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Profile ID: LFUS-PAI-P-212256