4. Metal fusion bonding
  5. Process
  6. Plural joints

Miguel Angel Jimarez

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Exposed die overmolded flip chip package and fabrication method

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate

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Flip chip C4 extension structure and process

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Flip chip C4 extension structure and process

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Method of solder removal

Metal fusion bonding – Process – With removing or reshaping of filler material or flash after...
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Receptor pad structure for chip carriers

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate

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Profile ID: LFUS-PAI-P-300804

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