Etching apparatus, a method of controlling an etching...

Details Etching apparatus, a method of controlling an etching... Etching apparatus, a method of controlling an etching...

2007-09-11

2007-09-11

Deo, Duy-Vu N (Department: 1765)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

C156S345110, C156S345150, C156S345170, C156S345180, C156S345240

Reexamination Certificate

active

10922905

ABSTRACT:
An etching apparatus includes a chamber containing an etching solution including first and second components and water, a concentration of the water in the etching solution is at a specified level or lower; a circulation path circulating the etching solution; a concentration controller sampling the etching liquid from the circulation path and controls concentrations of the etching solution respectively; and a refilling chemical liquid feeder feeding a refilling chemical liquid including the first component having a concentration higher than the first component in the etching solution.

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patent: 6645876 (2003-11-01), Saito et al.
patent: 2006/0151112 (2006-07-01), Yoshida et al.
patent: 6-333898 (1994-12-01), None
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Notification of Reasons for Refusal issued by the Japanese Patent Office dated May 16, 2006, for Japanese Patent Application No. 2004-124070, and English-language translation thereof.
Notification of Reasons for Refusal issued by the Japanese Patent Office dated May 15, 2007, for Japanese Patent Application No. 2004-124070, and English-language translation thereof.

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