4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Encapsulating

Noriaki Higuchi

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Epoxy resin composition and semiconductor device encapsulated th

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Patent

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Epoxy resin compositions and semiconductor devices encapsulated

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Patent

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Injection molding device and method for manufacturing a foil dec

Plastic and nonmetallic article shaping or treating: processes – Mechanical shaping or molding to form or reform shaped article – To produce composite – plural part or multilayered article
Patent

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Inorganic filler, epoxy resin composition, and semiconductor dev

Compositions: coating or plastic – Materials or ingredients – Pigment – filler – or aggregate compositions – e.g. – stone,...
Patent

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Inorganic filler, epoxy resin composition, and semiconductor...

Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...
Reexamination Certificate

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Profile ID: LFUS-PAI-P-535888

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