Epitaxy silicon on insulator (ESOI)

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257SE27112

Reexamination Certificate

active

08049277

ABSTRACT:
Methods and structures for semiconductor devices with STI regions in SOI substrates is provided. A semiconductor structure comprises an SOI epitaxy island formed over a substrate. The structure further comprises an STI structure surrounding the SOI island. The STI structure comprises a second epitaxial layer on the substrate, and a second dielectric layer on the second epitaxial layer. A semiconductor fabrication method comprises forming a dielectric layer over a substrate and surrounding a device fabrication region in the substrate with an isolation trench extending through the dielectric layer. The method also includes filling the isolation trench with a first epitaxial layer and forming a second epitaxial layer over the device fabrication region and over the first epitaxial layer. Then a portion of the first epitaxial layer is replaced with an isolation dielectric, and then a device such as a transistor is formed second epitaxial layer within the device fabrication region.

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patent: 4619033 (1986-10-01), Jastrzebski
patent: 5185286 (1993-02-01), Eguchi
patent: 5876497 (1999-03-01), Atoji
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patent: 6479354 (2002-11-01), Moon
patent: 2006/0157708 (2006-07-01), Shin
patent: 2007/0218659 (2007-09-01), Spencer et al.

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