Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Multiple layers
Reexamination Certificate
2009-04-06
2010-02-23
Garber, Charles D (Department: 2812)
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
Multiple layers
C438S763000, C257SE21090, C257SE21092, C257SE21102
Reexamination Certificate
active
07666799
ABSTRACT:
A relaxed silicon germanium structure comprises a silicon buffer layer produced using a chemical vapor deposition process with an operational pressure greater than approximately 1 torr. The relaxed silicon germanium structure further comprises a silicon germanium layer deposited over the silicon buffer layer. The silicon germanium layer has less than about 107threading dislocations per square centimeter. By depositing the silicon buffer layer at a reduced deposition rate, the overlying silicon germanium layer can be provided with a “crosshatch free” surface.
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Arena Chantal
Bauer Matthias
Cody Nyles
Tomasini Pierre
ASM America Inc.
Garber Charles D
Isaac Stanetta D
Knobbe Martens Olson & Bear LLP
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