Encapsulation of MEMS devices using pillar-supported caps

Details Encapsulation of MEMS devices using pillar-supported caps Encapsulation of MEMS devices using pillar-supported caps

2006-12-26

2006-12-26

Whitehead, Jr., Carl (Department: 2813)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Thermally responsive

Reexamination Certificate

active

07153717

ABSTRACT:
This invention comprises a process for fabricating a MEMS microstructure in a sealed cavity wherein the etchant entry holes are created as a by-product of the fabrication process without an additional step to etch holes in the cap layer. The process involves extending the layers of sacrificial material past the horizontal boundaries of the cap layer. The cap layer is supported by pillars formed by a deposition in holes etched through the sacrificial layers, and the etchant entry holes are formed when the excess sacrificial material is etched away, leaving voids between the pillars supporting the cap.

REFERENCES:
patent: 4665610 (1987-05-01), Barth
patent: 5683591 (1997-11-01), Offenberg
patent: 5834333 (1998-11-01), Seefeldt et al.
patent: 6323982 (2001-11-01), Hornbeck
patent: 6441451 (2002-08-01), Ikeda et al.
patent: 2004/0036133 (2004-02-01), Rodgers

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