Electrostatic chuck with an impregnated, porous layer that exhib

Details Electrostatic chuck with an impregnated, porous layer that exhib Electrostatic chuck with an impregnated, porous layer that exhib

1996-01-11

1999-06-29

Speer, Timothy M.

Stock material or miscellaneous articles

Composite

Of metal

428469, 428472, 4283066, 4283073, 361230, 361234, 279128, 268 8, 268 13, B32B 1508

Patent

active

059166894

ABSTRACT:
An electrostatic chuck including a pedestal having a conductive upper surface; and a layer of plasma-sprayed material formed on the upper surface of the pedestal and defining a surface onto which a substrate is placed during use, wherein the plasma-sprayed material exhibits the Johnson-Rahbeck effect when a bias is applied between the substrate and the pedestal.

REFERENCES:
patent: 4480284 (1984-10-01), Tojo
patent: 5350479 (1994-09-01), Collins et al.
patent: 5792562 (1998-08-01), Collins
Lane, "Numerical Modelling of Electrostatic Chucks: De-Chucking; Plasma Dynamics," Presentation to ESC Working Group Meeting, 1-32 (Feb. 1993).
Hartsough, "Electrostatic Wafer Holding," Solid State Technology, 87-90 (Jan. 1993).
Field, "Electrostatic Wafer Clamping: Advanced Temperatures Control for Next-Generation Manufacturing," Publication Unknown, 83-88 (Feb. 1994).

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