Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate
2005-06-14
2005-06-14
Clark, Jasmine (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
C257S783000, C257S775000, C438S108000, C438S118000, C438S119000
Reexamination Certificate
active
06906428
ABSTRACT:
An electronic component and a method for populating a circuit carrier during the production of the electronic component includes providing the semiconductor chip with at least one buffer body on its active top side, which buffer body, during the populating method, protects the semiconductor component structures—disposed under the buffer body—of the active top side of the semiconductor chip against mechanical damage and has a protective layer of a mechanically damping material.
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Clark Jasmine
Greenberg Laurence A.
Infineon - Technologies AG
Locher Ralph E.
Stemer Werner H.
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