4. Package making
  5. Methods
  6. Forming or partial forming a receptacle and subsequent filling

Rudolf Lehner

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Apparatus and method for populating transport tapes

Package making – Methods – Forming or partial forming a receptacle and subsequent filling
Reexamination Certificate

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Apparatus for populating transport tapes

Package making – Apparatus for forming or partially forming receptacle and... – Forming a pocket – depression – or hollow compartment by...
Reexamination Certificate

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Apparatus for singulating and bonding semiconductor chips,...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Configuration and method for contacting circuit structure

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate

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Electronic component having a semiconductor chip and method...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2757475

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