Dual fully-silicided gate MOSFETs

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S197000, C438S682000, C438S630000, C438S592000, C438S664000, C438S305000, C438S303000, C438S286000, C438S301000, C438S224000, C438S229000, C438S230000, C438S231000, C257S757000, C257S250000, C257S407000, C257S408000

Reexamination Certificate

active

06905922

ABSTRACT:
A semiconductor device having a plurality of silicidation steps is provided. In the preferred embodiment in which the semiconductor device is a MOSFET, the source/drain regions are silicided. A dielectric layer is formed and the etch stop layer is removed from the gate electrode of the MOSFET. A second silicidation process is performed to silicide the gate electrode. The process may be performed individually for each transistor, allowing the electrical characteristics of each transistor to be determined individually.

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Tavel, B., et al., “Totally Silicided (CoSi2) Polysilicon: A Novel Approach To Very Low-Resistive Gate (˜2Ω/□) Without Metal CMP Nor Etching)” IEDM (Mar. 2001) pp. 825-828.
Maszara, W.P., et al., “Transistors With Dual Work Function Metal Gates By Single Full Silicidation (FUSI) Of Polysilicon,” IEDM (Feb. 2002) pp. 367-370.

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