Dual exposure track only pitch split process

Details Dual exposure track only pitch split process Dual exposure track only pitch split process

2011-08-09

2011-08-09

Garber, Charles D (Department: 2812)

Semiconductor device manufacturing: process

Chemical etching

Combined with coating step

C438S695000, C438S703000, C438S761000, C257SE21017, C257SE21025, C257SE21026, C257SE21027

Reexamination Certificate

active

07994060

ABSTRACT:
An integrated circuit is formed with structures spaced more closely together than a transverse dimension of such structures, such as for making contacts to electronic elements formed at minimum lithographically resolvable dimensions by dark field split pitch techniques. Acceptable overlay accuracy and process efficiency and throughput for the split pitch process that requires etching of a hard mark for each of a plurality of sequentially applied and patterned resist layers is supported by performing the etching of the hard mask entirely within a lithography track through using an acid sensitive hard mark material and an acidic overcoat which contacts areas of the hard mask through patterned apertures in the resist. The contacted areas of the hard mask are activated for development by baking of the acidic overcoat.

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