Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1997-08-19
1999-11-23
Beck, Shrive
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
427123, 427 96, B05D 512
Patent
active
059896230
ABSTRACT:
The present invention generally provides a metallization process for forming a highly integrated interconnect. More particularly, the present invention provides a dual damascene interconnect module that incorporates a barrier layer deposited on all exposed surface of a dielectric layer which contains a dual damascene via and wire definition. A conductive metal is deposited on the barrier layer using two or more deposition methods to fill the via and wire definition prior to planarization. The invention provides the advantages of having copper wires with lower resistivity (greater conductivity) and greater electromigration resistance than aluminum, a barrier layer between the copper wire and the surrounding dielectric material, void-free, sub-half micron selective CVD Al via plugs, and a reduced number of process steps to achieve such integration.
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European International Search Report Dated Nov. 5, 1998.
Chen Liang-Yuh
Guo Ted
Mosely Roderick Craig
Tao Rong
Applied Materials Inc.
Beck Shrive
Strain Paul D.
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