Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2006-09-29
2010-02-09
Mulpuri, Savitri (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S122000, C257SE21511
Reexamination Certificate
active
07659143
ABSTRACT:
A method includes mating a first heat spreader and a second heat spreader, such that the first heat spreader at a mating surface and second heat spreader at a mating surface become parallel and adjacent. The mated first heat spreader and second heat spreader have at least one convection channel disposed therebetween. A process includes placing a first die in a first die recess of the first heat spreader, and placing a second die on a second die site on the second heat spreader. The process includes reflowing thermal interface material between each die and respective heat spreader. A package is achieved by the method, with reduced thicknesses. The package can be coupled through a bumpless build-up layer. The package can be assembled into a computing system.
REFERENCES:
patent: 6424533 (2002-07-01), Chu et al.
patent: 6709898 (2004-03-01), Ma et al.
patent: 7109581 (2006-09-01), Dangelo et al.
patent: 7305839 (2007-12-01), Weaver, Jr.
patent: 7402906 (2008-07-01), Rahman Khan et al.
patent: 7408263 (2008-08-01), Meth
patent: 7446409 (2008-11-01), Yang
patent: 7511359 (2009-03-01), Tang et al.
patent: 2007/0284730 (2007-12-01), Shi et al.
patent: 2008/0023665 (2008-01-01), Weiser et al.
patent: 2008/0032449 (2008-02-01), Tan et al.
patent: 2008/0054448 (2008-03-01), Lu et al.
patent: 2008/0073776 (2008-03-01), Suh et al.
He Jiangqi
Lu Daoqiang
Tang Jiamiao
Zeng Xiang Yin
Greaves John N.
Intel Corporation
Mulpuri Savitri
LandOfFree
Dual-chip integrated heat spreader assembly, packages... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Dual-chip integrated heat spreader assembly, packages..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Dual-chip integrated heat spreader assembly, packages... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4227417