4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Assembly of plural semiconductive substrates each possessing...

Xiang Yin Zeng

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Array capacitor apparatuses to filter input/output signal

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Copper plating connection for multi-die stack in substrate...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Data signal interconnection with reduced crosstalk

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate

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Dual-chip integrated heat spreader assembly, packages...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Extended thin film capacitor (TFC)

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor
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Profile ID: LFUS-PAI-P-2176797

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