Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1995-12-22
1998-12-01
Nguyen, Nam
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
216 23, 216 24, 216 60, 216 67, 216 72, 216 76, H01L 21306
Patent
active
058432779
ABSTRACT:
An RIE method and apparatus for etching through the material layer of a transparent-electrode (ITO) in a single continuous step at a rate better than 100 .ANG./min and with a selectivity better than 20 to 1 is disclosed. Chamber pressure is maintained at least as low as 60 mTorr. A reactive gas that includes ethyl iodide C.sub.2 H.sub.5 I) is used alone or in combination with another gas such as O.sub.2. Plasma-induced light emissions of reaction products and/or the reactants are monitored to determine the time point of effective etch-through.
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Goto Haruhiro (Harry)
Law Kam S.
Su Yuh-Jia
Wong Yuen-Kui
Alanko Anita
Applied Komatsu Technology Inc.
Nguyen Nam
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