Etching a substrate: processes – Gas phase etching of substrate – Application of energy to the gaseous etchant or to the...
Patent
1993-10-22
1996-01-02
Dang, Thi
Etching a substrate: processes
Gas phase etching of substrate
Application of energy to the gaseous etchant or to the...
216 67, 156345, 118723E, 427569, H05H 100
Patent
active
054800528
ABSTRACT:
A domed dielectric extension is set atop a standard electrode in a bell jar shaped process chamber to decrease electrical interaction between the electrode and the process chamber and thereby decrease the stagnant plasma in the region between the electrode and the process chamber lid that promotes polymer deposition upon the inner surface of a process chamber lid. The extension, made of a process inert dielectric material such as polycarbonate, has an upper surface that is curved to conform to the shape of the inner surface of the process chamber lid and that is precisely spaced from the upper portion of the process chamber lid inner surface.
REFERENCES:
patent: 4298443 (1981-03-01), Maydan
patent: 4419201 (1983-12-01), Levinstein et al.
patent: 4786392 (1988-11-01), Kruchowski et al.
patent: 4968374 (1990-11-01), Tsukada et al.
patent: 5112185 (1992-05-01), Koike
patent: 5298720 (1994-03-01), Cuomo et al.
Blackburn Greg
Furr Michael G.
Kava Joseph
McGovern Richard
Applied Materials Inc.
Dang Thi
Glenn Michael A.
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