Dishing and erosion monitor structure for damascene metal proces

Details Dishing and erosion monitor structure for damascene metal proces Dishing and erosion monitor structure for damascene metal proces

1996-11-13

1999-02-23

Bowers, Charles

Semiconductor device manufacturing: process

Including control responsive to sensed condition

Optical characteristic sensed

438 7, 438 9, H01L 2100

Patent

active

058743189

ABSTRACT:
According to the preferred embodiment, an erosion and dishing monitor and monitor method are provided that facilitates the accurate optimization of a planarization process as in semiconductor process. The dishing monitor comprises at least two monitor structure sets embedded in a semiconductor substrate, the monitor structure sets comprising a plurality of monitor structures connected together with a plurality of connective conductors. The erosion monitor comprises a plurality of elongated conductors embedded into a semiconductor substrate, the plurality of conductors having varying conductor widths and adjacent substrate widths.

REFERENCES:
patent: 4793895 (1988-12-01), Kaanta et al.
patent: 5057441 (1991-10-01), Gutt et al.
patent: 5234868 (1993-08-01), Cote
patent: 5241266 (1993-08-01), Ahmad et al.
patent: 5337015 (1994-08-01), Lustig et al.
patent: 5444637 (1995-08-01), Smesny et al.

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