4. Plastic article or earthenware shaping or treating: apparatus
  5. Distinct means to feed, support or manipulate preform stock...
  6. Opposed registering coacting female molds

Shafidul Islam

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Die pad for semiconductor packages and methods of making and...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
Reexamination Certificate

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Lead frame routed chip pads for semiconductor packages

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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New IC molding process

Plastic article or earthenware shaping or treating: apparatus – Distinct means to feed – support or manipulate preform stock... – Opposed registering coacting female molds
Patent

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Package having exposed integrated circuit device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Package having exposed integrated circuit device

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With peripheral feature due to separation of smaller...
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1078290

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