Deposition chamber for improved deposition thickness uniformity

Details Deposition chamber for improved deposition thickness uniformity Deposition chamber for improved deposition thickness uniformity

1995-12-13

1998-06-30

Breneman, R. Bruce

Coating apparatus

Gas or vapor deposition

With treating means

118715, 20429807, C23C 1600

Patent

active

057727716

ABSTRACT:
An improved deposition chamber (2) includes a housing (4) defining a vacuum chamber (18) which houses a substrate support (14). A set of first nozzles (34) have orifices (38) opening into the vacuum chamber in a circumferential pattern spaced apart from and generally overlying the periphery (40) of the substrate support. One or more seconds nozzle (56, 56a), positioned centrally above the substrate support, inject process gases into the vacuum chamber to improve deposition thickness uniformity. Deposition thickness uniformity is also improved by ensuring that the process gases are supplied to the first nozzles at the same pressure. If needed, enhanced cleaning of the nozzles can be achieved by slowly drawing a cleaning gas from within the vacuum chamber in a reverse flow direction through the nozzles using a vacuum pump (84).

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