Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With gas inlet structure
Reexamination Certificate
2004-11-23
2008-08-19
Lund, Jeffrie R (Department: 1792)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With gas inlet structure
C156S345480, C118S715000, C118S7230IR, C118S7230IR
Reexamination Certificate
active
07413627
ABSTRACT:
An improved deposition chamber (2) includes a housing (4) defining a chamber (18) which houses a substrate support (14). A mixture of oxygen and SiF4is delivered through a set of first nozzles (34) and silane is delivered through a set of second nozzles (34a) into the chamber around the periphery (40) of the substrate support. Silane (or a mixture of silane and SiF4) and oxygen are separately injected into the chamber generally centrally above the substrate from orifices (64, 76). The uniform dispersal of the gases coupled with the use of optimal flow rates for each gas results in uniformly low (under 3.4) dielectric constant across the film.
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Collins Alan W.
Ishikawa Tetsuya
Li Shijian
Redeker Fred C.
Wang Yaxin
Applied Materials Inc.
Lund Jeffrie R
Townsend and Townsend and Crew
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