Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Reexamination Certificate
1998-10-13
2002-08-27
Huff, Mark F. (Department: 1756)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
C430S311000, C430S313000, C430S317000
Reexamination Certificate
active
06440641
ABSTRACT:
BACKGROUND OF THE INVENTION
The present invention relates to the use of thin film deposition technology to create high density interconnects on a conventional printed wiring board substrate. More specifically, the present invention pertains to an improved method for minimizing the effects of accumulated stress between the printed wiring board substrate and the overlying deposited thin film layers. The method of the present invention can be used with or without conventional build-up layers and/or an initial conventional build-up layer and is useful for high density integrated circuit packaging of single chip, multi-chip, and support components such as resistors and capacitors. The method of the present invention is also useful for creating interconnections on high density daughter boards that carry packaged devices.
The semiconductor industry continues to produce integrated circuits of increasing complexity and increasing density. The increased complexity of some of these integrated circuits has in turn resulted in an increased number of input/output pads on the circuit chips. At the same time, the increased density of the chips has driven the input/output pad pitch downward. The combination of these two trends has been a significant increase in the connector pin wiring density needed to connect the chips to packages that interface with the outside world and interconnect the chips to other integrated circuit devices.
A number of different technologies have been developed to interconnect one or more integrated circuits and related components. One such technology is based on traditional printed wiring board (PWB) technology that found wide use during the period in which integrated circuits were packaged in surface mount devices like quad flat packs (QFPs). When used to interconnect multiple integrated circuits this PWB technology is often referred to as MCM-L or laminate MCM technology. PWB technology typically uses copper and insulating dielectric material sub-laminates as building blocks to create the required interconnect structures. The process of forming a copper conductive pattern on the sub-laminate in PWB technology typically includes forming a dry film of photo resist over the copper layer, patterning and developing the photo resist to from an appropriate mask and selectively etching away the unwanted copper thereby leaving the desired patterned conductive layer.
Substrates used in PWB technology can be manufactured in large area panels providing efficiencies that lower the costs of production. Interconnect solutions using this technology generally have relatively good performance characteristics because of the copper and low dielectric constant (e.g. less than or equal to 4.0) employed. The printed wiring board industry, however, has not kept pace with the advances in semiconductor manufacturing in terms of pad density and pad count. As a result, there is a capability gap between semiconductor manufacturers and interconnect printed wiring board manufactures.
In some applications, two or more pieces of laminate are laminated together to form a final structure. Interconnection between laminated layers can be provided by through hole mechanical drilling, followed by plating. The drilling process is relatively slow and expensive and can require a large amount of board space. As the number of interconnect pads increases, an increased number of signal layers is often used to form the interconnect structure. Because of these limitations, the conventional printed wiring board technology needs to go to a large number of metal layers (e.g. greater than eight layers) for some of the applications in high density integrated circuit packaging and daughter board fabrication. Utilizing a large number of layers in this context generally increases cost and decreases electrical performance. Also, the pad size limits the wiring density on any given layer with this technology. Thus, PWB technology, while useful for some applications, is not capable of providing the connection density required in other applications. To improve the interconnect density of PWB technology, an advanced printed wiring board technology approach called build-up multi-layer has been developed. In this technology a traditional printed wiring board core is the starting point. Standard drilling and plating techniques are used to form plated through holes in the core. From the basic core this build-up approach has many variations. Typically a dielectric layer approximately 50 microns thick is laminated to both the top and bottom major surfaces of the conventionally fabricated printed wiring board substrate. Vias are made in the build-up layer by laser ablation, photo mask/plasma etch, or other known methods. An electroless seeding step is then done prior to a panel plating step that metalizes both the upper and lower surfaces. Subsequent masking and wet etching steps then define a desired conductive pattern over the laminated dielectric layers.
This technology offers a large improvement in terms of density over standard PWB technology without build-up layers; however, such build-up boards require multiple layers in order to meet the developing high density packaging and daughter board requirements. Thus this technology still has limitations.
Another conventional approach used to package high density interconnect applications uses cofired ceramic substrates and is referred to generally as multilayer ceramic or MLC technology or as MCM-C, cofired ceramic MCM and thick film MCM technology in the multichip module context. Basically, MLC technology involves rolling a ceramic mix into sheets, drying the sheets, punching vias, screening the rolled sheets with a metal paste representing the trace pattern on the surface of the ceramic, stacking and laminating all the layers together, then cofiring at a high temperature (e.g. greater than 850° C.) to achieve the desired interconnections.
MLC construction has found extensive use in high density and high reliability products where the robustness of the high density interconnect package outweighs the cost considerations. The ability to create a hermetic seal in the ceramic improves the ability to withstand environments not tolerable to conventional printed wiring board technology. While this technology is capable of high density packaging applications (e.g. greater than 1000 pads), it is also very costly. Additionally, performance characteristics, such as signal propagation time, are impacted due to the relatively high dielectric constant (e.g. between 5.0 and 9.0) of the ceramic material. MLC technology provides higher connection density than PWB technology, but is not capable of providing the connection density required for some of today's high density interconnect applications.
A third approach which the high density interconnect and packaging industry has moved toward to address these high density interconnect applications uses thin film deposition technology and is sometimes referred to as deposited on laminate or DONL technology in a broad sense and as MCM-D or MCM deposition technology in a multichip module context. In some applications, such DONL technology includes forming and patterning thin film conductive traces over large substrates such as the laminated printed wiring boards discussed above. Such large substrates may have a surface area of 40 centimeters by 40 centimeters or more, thereby providing efficiencies that lower the costs of production.
DONL technology utilizes a combination of low cost printed wiring board structures, with or without the use of the build-up multi-layers on the printed wiring board, as a starting point to meet the high density and low cost interconnect requirements. This combination of existing conventional high volume printed wiring board technology and advanced thin film deposition technology represents a significant economic advantage and density improvement as compared to the previously discussed PWB and MLC technologies.
One significant feature of DONL technology is that it creates a high interconnect density substrate using thin f
Lykins James L.
Strandberg Jan I.
Barreca Nicole
Huff Mark F.
Kulicke & Soffa Holdings, Inc.
Townsend and Townsend / and Crew LLP
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