4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. To form ohmic contact to semiconductive material

Jan I. Strandberg

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Deposited thin film build-up layer dimensions as a method of...

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Reexamination Certificate

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High density chip level package for the packaging of...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
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High density chip level package for the packaging of...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
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Isolated flip chip of BGA to minimize interconnect stress...

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
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Isolated flip chip or BGA to minimize interconnect stress...

Metal fusion bonding – Process – Bonding nonmetals with metallic filler
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Profile ID: LFUS-PAI-P-1158335

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