Corporate Assignee
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
Corporate Assignee
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Deposited thin film build-up layer dimensions as a method of...
Isolated flip chip of BGA to minimize interconnect stress...
Isolated flip chip or BGA to minimize interconnect stress...
Low-impedance high-density deposited-on-laminate structures...
Method and structure for detecting open vias in high density...
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