Depletion mode MOS capacitor with patterned V.sub.T implants

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

438548, 438549, 438217, 438241, 438250, 438251, 438275, 438276, 438289, H01L 218238

Patent

active

061035610

ABSTRACT:
A method for making a memory cell (10) in a process in which both an n-channel MOS transistors (12) and a p-channel transistor (44) are formed in a semiconductor substrate (30) is presented. The method includes implanting an impurity (40) into a region of the substrate (30) to form a part of a depletion NMOS memory capacitor (21) to be associated with the n-channel MOS memory transistor (12). The implant is performed concurrently with a patterned implant with the same impurity to adjust the threshold and punch-through of the p-channel transistor (44).

REFERENCES:
patent: 4131983 (1979-01-01), Matzen
patent: 4696092 (1987-09-01), Doering et al.
patent: 4950617 (1990-08-01), Kumagai et al.
patent: 5071784 (1991-12-01), Takeuchi et al.
patent: 5238860 (1993-08-01), Sawada et al.
patent: 5484739 (1996-01-01), Lee et al.
patent: 5736415 (1998-04-01), Chang et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Depletion mode MOS capacitor with patterned V.sub.T implants does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Depletion mode MOS capacitor with patterned V.sub.T implants, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Depletion mode MOS capacitor with patterned V.sub.T implants will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2005795

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.