Electronic digital logic circuitry – With test facilitating feature
Reexamination Certificate
2011-03-01
2011-03-01
Tran, Anh Q (Department: 2819)
Electronic digital logic circuitry
With test facilitating feature
C326S009000, C326S014000
Reexamination Certificate
active
07898286
ABSTRACT:
Cross-die connection structure and method for a die or chip includes buffer elements having a buffer driver and bypass, and control lines coupled to the buffer elements in order to select one of the buffer driver and bypass for each respective buffer element. A logic network is arranged with the buffer elements to form functional paths, a test unit is structured and arranged to test the functional paths and to be coupled to the control lines, and a configuration storage register to set the selected one of the buffer driver and bypass for each passing functional path.
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Arsovski Igor
Cranford, Jr. Hayden C.
Iadanza Joseph A.
Leonard Todd E.
Norman Jason M.
Cain David
International Business Machines - Corporation
Roberts Mlotkowski Safran & Cole. P.C.
Tran Anh Q
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