Critical dimension control in a semiconductor fabrication...

Details Critical dimension control in a semiconductor fabrication... Critical dimension control in a semiconductor fabrication...

2007-12-11

2007-12-11

Tran, Binh X. (Department: 1765)

Etching a substrate: processes

Gas phase etching of substrate

With measuring, testing, or inspecting

C216S060000, C216S066000, C216S072000

Reexamination Certificate

active

10768455

ABSTRACT:
A method for controlling a critical dimension in an etched structure comprises the steps of: forming a hard mask above a substrate, measuring a critical dimension of the hard mask, and using the measured hard mask critical dimension to control a critical dimension trim operation performed on a circuit trace above the substrate.

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W. Jarrett Campbell, Ph.D., “Run-To-Run Control Of Photolithography Processes”, Summer 2000 Yield Management Solutions, pp. 65-68.

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