Corrosion resistant component of semiconductor processing...

Details Corrosion resistant component of semiconductor processing... Corrosion resistant component of semiconductor processing...

2006-09-22

2009-10-20

Tran, Binh X (Department: 1792)

Semiconductor device manufacturing: process

Chemical etching

Combined with coating step

C438S762000, C438S780000, C438S787000, C427S447000

Reexamination Certificate

active

07605086

ABSTRACT:
A corrosion resistant component of a plasma chamber includes a liquid crystalline polymer. In a preferred embodiment, the liquid crystalline polymer (LCP) is provided on an aluminum component having an anodized or non-anodized surface. The liquid crystalline polymer can also be provided on an alumina component. The liquid crystalline polymer can be deposited by a method such as plasma spraying. The liquid crystalline polymer may also be provided as a preformed sheet or other shape adapted to cover the exposed surfaces of the reaction chamber. Additionally, the reactor components may be made entirely from liquid crystalline polymer by machining the component from a solid block of liquid crystalline polymer or molding the component from the polymer. The liquid crystalline polymer may contain reinforcing fillers such as glass or mineral fillers.

REFERENCES:
patent: 4340462 (1982-07-01), Koch
patent: 4491496 (1985-01-01), Laporte et al.
patent: 4736087 (1988-04-01), Whitlock et al.
patent: 4948458 (1990-08-01), Ogle
patent: 5200232 (1993-04-01), Tappan et al.
patent: 5216092 (1993-06-01), Huspeni et al.
patent: 5248530 (1993-09-01), Jester et al.
patent: 5262029 (1993-11-01), Erskine et al.
patent: 5296542 (1994-03-01), Layton et al.
patent: 5366585 (1994-11-01), Robertson et al.
patent: 5396104 (1995-03-01), Kimura
patent: 5397502 (1995-03-01), Waggoner et al.
patent: 5413058 (1995-05-01), Hirose et al.
patent: 5434210 (1995-07-01), Rangaswamy et al.
patent: 5474649 (1995-12-01), Kava et al.
patent: 5522932 (1996-06-01), Wong et al.
patent: 5606485 (1997-02-01), Shamouilian et al.
patent: 5641375 (1997-06-01), Nitescu et al.
patent: 5680013 (1997-10-01), Dornfest et al.
patent: 5718967 (1998-02-01), Hu et al.
patent: 5720818 (1998-02-01), Donde et al.
patent: 5798016 (1998-08-01), Oehrlein et al.
patent: 5820723 (1998-10-01), Benjamin et al.
patent: 5824605 (1998-10-01), Chen et al.
patent: 5838529 (1998-11-01), Shufflebotham et al.
patent: 5863376 (1999-01-01), Wicker et al.
patent: 5879523 (1999-03-01), Wang et al.
patent: 5885356 (1999-03-01), Zhao et al.
patent: 5895586 (1999-04-01), Kaji et al.
patent: 5939153 (1999-08-01), Valyi
patent: 6013749 (2000-01-01), Baba et al.
patent: 6048798 (2000-04-01), Gadgil et al.
patent: 6048919 (2000-04-01), McCullough
patent: 6120854 (2000-09-01), Clarke et al.
patent: 6250251 (2001-06-01), Akiyama et al.
patent: 6251216 (2001-06-01), Okamura et al.
patent: 6261974 (2001-07-01), Kawahara et al.
patent: 6294261 (2001-09-01), Sangeeta et al.
patent: 6319325 (2001-11-01), Hiratsuka et al.
patent: 6326597 (2001-12-01), Lubomirsky et al.
patent: 6372299 (2002-04-01), Thompson et al.
patent: 6403491 (2002-06-01), Liu et al.
patent: 6468665 (2002-10-01), Nagashima et al.
patent: 6508911 (2003-01-01), Han et al.
patent: 6703092 (2004-03-01), Nakagawa et al.
patent: 2001/0003271 (2001-06-01), Otsuki
patent: 2002/0036881 (2002-03-01), Shamouilian et al.
patent: 0443778 (1991-08-01), None
patent: 0845545 (1998-06-01), None
patent: 62-103379 (1987-05-01), None
patent: 03-269076 (1991-11-01), None
patent: 05-226796 (1993-09-01), None
patent: 09-298190 (1997-11-01), None
patent: 10-229058 (1998-08-01), None
patent: 11-345780 (1999-12-01), None
patent: 2000-100781 (2000-04-01), None
Nakwgawa, Shinichi (WO 99/63584), “Resin Molded Article for Chamber Liner”, Dec. 9, 1999, World Intellectual Property Organization.
Deronzier, J.C. et al., “Plate Heat Exchangers in Liquid-Crystal Polymers,” Applied Thermal Engineering, vol. 17, Nos. 8-10, pp. 799-808, 1997.
Written Opinion dated Aug. 23, 2002 for PCT/US01/43152.
Notification of Transmittal of the International Search Report or the Declaration dated Aug. 21, 2006 for PCT/US01/43152.

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