Copper recess process with application to selective capping...

Details Copper recess process with application to selective capping... Copper recess process with application to selective capping...

2006-06-20

2006-06-20

Potter, Roy (Department: 2822)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S675000, C438S687000

Reexamination Certificate

active

07064064

ABSTRACT:
An integrated circuit structure is disclosed that has a layer of logical and functional devices and an interconnection layer above the layer of logical and functional devices. The interconnection layer has a substrate, conductive features within the substrate and caps positioned only above the conductive features.

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