4. Adhesive bonding and miscellaneous chemical manufacture
  5. Delaminating processes adapted for specified product
  6. Delaminating in preparation for post processing recycling step

Chao-Kun Hu

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Aluminum-based metallization exhibiting reduced...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Chip to wiring interface with single metal alloy layer...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Copper alloys for chip and package interconnections

Stock material or miscellaneous articles – All metal or with adjacent metals – Having metal particles
Patent

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Copper interconnection structure incorporating a metal seed...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Copper interconnection structure incorporating a metal seed...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Profile ID: LFUS-PAI-P-446082

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