Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1998-04-30
2000-08-15
Luebke, Renee
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439 71, H01R 1200
Patent
active
061027103
ABSTRACT:
An interposer substrate for mounting an integrated circuit chip to a substrate, and method of making the same, are shown. The interposer substrate comprises power supply paths and controlled impedance signal paths that are substantially isolated from each other. Power supply is routed through rigid segments and signals are routed through a thin film flexible connector that runs from the upper surface of the interposer substrate to the lower surface. Bypass capacitance is incorporated into the interposer substrate and connected to the power supply so that it is positioned very close to the integrated circuit chip. The interposer may be fabricated by forming a multilayered thin film structure including the signal paths over a rigid substrate having vias formed therein, removing the central portion of the substrate leaving the two end segments, and folding and joining the end segments such that the vias are connected. In another embodiment of the invention, a separate power plate is provided for carrying the power lines. Portions of the power plate, with a multilayered thin film structure thereon, are cut and folded to form interposers. Methods of making single-chip interposers are also disclosed.
REFERENCES:
patent: 3611317 (1971-10-01), Bonfeld
patent: 3629787 (1971-12-01), Wilson
patent: 3643135 (1972-02-01), Devore et al.
patent: 3949274 (1976-04-01), Anacker
patent: 4202007 (1980-05-01), Dougherty et al.
patent: 4249302 (1981-02-01), Crepeau
patent: 4271588 (1981-06-01), Nowak
patent: 4289922 (1981-09-01), Devlin
patent: 4371744 (1983-02-01), Badet et al.
patent: 4453176 (1984-06-01), Chance et al.
patent: 4480288 (1984-10-01), Gazdik et al.
patent: 4489363 (1984-12-01), Goldberg
patent: 4499607 (1985-02-01), Higgins
patent: 4502098 (1985-02-01), Brown et al.
patent: 4509099 (1985-04-01), Takamatsu et al.
patent: 4525921 (1985-07-01), Carson et al.
patent: 4547834 (1985-10-01), Dumont et al.
patent: 4574331 (1986-03-01), Smolley
patent: 4581679 (1986-04-01), Smolley
patent: 4601526 (1986-07-01), White et al.
patent: 4631636 (1986-12-01), Andrews
patent: 4638348 (1987-01-01), Brown et al.
patent: 4640010 (1987-02-01), Brown
patent: 4648179 (1987-03-01), Bhattacharyya et al.
patent: 4679118 (1987-07-01), Johnson et al.
patent: 4688151 (1987-08-01), Kraus
patent: 4695872 (1987-09-01), Chatterjee
patent: 4716259 (1987-12-01), Takura et al.
patent: 4718163 (1988-01-01), Berland et al.
patent: 4721831 (1988-01-01), Vora
patent: 4727410 (1988-02-01), Higgins, III
patent: 4733461 (1988-03-01), Nakano
patent: 4739444 (1988-04-01), Zushi et al.
patent: 4743568 (1988-05-01), Wood
patent: 4770640 (1988-09-01), Walter
patent: 4771366 (1988-09-01), Blake et al.
patent: 4774630 (1988-09-01), Reisman et al.
patent: 4781969 (1988-11-01), Kobayashi et al.
patent: 4800461 (1989-01-01), Dixon et al.
patent: 4801992 (1989-01-01), Golubic
patent: 4803595 (1989-02-01), Kraus et al.
patent: 4807021 (1989-02-01), Okumura
patent: 4811082 (1989-03-01), Jacobs et al.
patent: 4830623 (1989-05-01), Owens et al.
patent: 4841355 (1989-06-01), Parks
patent: 4855809 (1989-08-01), Malhi et al.
patent: 4855871 (1989-08-01), Young
patent: 4858073 (1989-08-01), Gregory
patent: 4859189 (1989-08-01), Petersen et al.
patent: 4862249 (1989-08-01), Carlson
patent: 4866508 (1989-09-01), Eichelberger et al.
patent: 4868712 (1989-09-01), Woodman
patent: 4871317 (1989-10-01), Jones
patent: 4873764 (1989-10-01), Grimm
patent: 4884167 (1989-11-01), Shinji Mine
patent: 4894706 (1990-01-01), Sato et al.
patent: 4899439 (1990-02-01), Potter et al.
patent: 4901136 (1990-02-01), Neugebauer et al.
patent: 4902637 (1990-02-01), Kondou et al.
patent: 4910643 (1990-03-01), Williams
patent: 4922059 (1990-05-01), Walker et al.
patent: 4922378 (1990-05-01), Malhi et al.
patent: 4930002 (1990-05-01), Takenaka et al.
patent: 4937659 (1990-06-01), Chall, Jr.
patent: 4937707 (1990-06-01), McBride
patent: 4939568 (1990-07-01), Kato et al.
patent: 4953005 (1990-08-01), Carlson et al.
patent: 4953060 (1990-08-01), Lauffer
patent: 4956695 (1990-09-01), Robinson et al.
patent: 4956746 (1990-09-01), Gates, Jr.
patent: 4956749 (1990-09-01), Chang
patent: 4958258 (1990-09-01), Charruau
patent: 4963697 (1990-10-01), Peterson et al.
patent: 4965702 (1990-10-01), Lott et al.
patent: 4970577 (1990-11-01), Ogihara et al.
patent: 4983533 (1991-01-01), Go
patent: 4984132 (1991-01-01), Sakurai
patent: 4991000 (1991-02-01), Bone et al.
patent: 4992908 (1991-02-01), Solomon
patent: 4996587 (1991-02-01), Hinrichsmeyer et al.
patent: 5003376 (1991-03-01), Iversen
patent: 5006920 (1991-04-01), Schnafer et al.
patent: 5006925 (1991-04-01), Bregman et al.
patent: 5007841 (1991-04-01), Smolley
patent: 5010448 (1991-04-01), Kobari
patent: 5016138 (1991-05-01), Woodman
patent: 5019945 (1991-05-01), Smolley
patent: 5025306 (1991-06-01), Johnson et al.
patent: 5027253 (1991-06-01), Lauffer et al.
patent: 5031072 (1991-07-01), Malhi et al.
patent: 5032896 (1991-07-01), Little et al.
patent: 5034569 (1991-07-01), Gofuku et al.
patent: 5049982 (1991-09-01), Lee et al.
patent: 5051865 (1991-09-01), Kato
patent: 5053856 (1991-10-01), Davidson
patent: 5055907 (1991-10-01), Jacobs
patent: 5060116 (1991-10-01), Grobman et al.
patent: 5061990 (1991-10-01), Arakawa et al.
patent: 5065277 (1991-11-01), Davidson
patent: 5081563 (1992-01-01), Feng et al.
patent: 5089880 (1992-02-01), Meyer et al.
patent: 5102828 (1992-04-01), Marchisi
patent: 5121297 (1992-06-01), Haas
patent: 5132613 (1992-07-01), Papae et al.
patent: 5142448 (1992-08-01), Kober et al.
patent: 5144532 (1992-09-01), Wessely et al.
patent: 5155661 (1992-10-01), Nagesh et al.
patent: 5177594 (1993-01-01), Chance et al.
patent: 5204806 (1993-04-01), Sasaki et al.
patent: 5205739 (1993-04-01), Malo et al.
patent: 5222014 (1993-06-01), Lin
patent: 5237204 (1993-08-01), Val
patent: 5258330 (1993-11-01), Khandros et al.
patent: 5278724 (1994-01-01), Angulas et al.
patent: 5309324 (1994-05-01), Herandez et al.
patent: 5334804 (1994-08-01), Love et al.
patent: 5346861 (1994-09-01), Khandros et al.
patent: 5347159 (1994-09-01), Khandros et al.
patent: 5349501 (1994-09-01), Kawakami
patent: 5355282 (1994-10-01), Yokemura et al.
patent: 5357400 (1994-10-01), Takekawa
patent: 5362656 (1994-11-01), McMahon et al.
patent: 5396034 (1995-03-01), Fujita et al.
patent: 5404273 (1995-04-01), Akagawa
patent: 5419038 (1995-05-01), Wang et al.
patent: 5426565 (1995-06-01), Anderson
patent: 5435733 (1995-07-01), Chernicky et al.
patent: 5479110 (1995-12-01), Crane et al.
patent: 5597982 (1997-01-01), Hlwada
Moresco, "System Interconnect Issues for Sub-Nanosecond Transmission," Proceedings of the International Symposium on Advances in Interconnection and Packaging, SPIE, Nov. 5, 1990, pp. 202-213.
Nagesh, et al., "A Comparative Study of Interconnect Technologies," Proceedings of the 9.sup.th International Electronics Packaging Conference, Bol. I (1989), from Multichip Modules by IEEE, Inc., 1991, pp. 557-566.
Liu, et al. "Integrated Circuit Chip Package," IBM Technical Disclosure Bulletin, vol. 17, No. 7, Dec. 1974.
Tummala, et al., Microelectronics Packaging Handbook, New York: Ban Nostrand Reinhold, 1989, pp. 955-974; pp.1034-1038; pp. 1071-1076.
Richard C. Dorf, ed., The Electrical Engineering Handbook, Boca Raton: CRC Press, 1993, pp. 499-529.
Scott S. Simpson, Invisicon The Invisible Interconnection--A connection system with high contact density and controlled impedance, Rogers Corporation, Product Information Brochure, date unknown.
Val, et al., 3-D Interconnection for Ultra-Dense Multichip Modules, IEEE Transactions On Components, Hybrids, and Manufacturing Technology, vol. 13, No. 4, Dec. 1990, pp. 814-821.
Andrews, "Parallel Printed Circuit Manifold," Motorola Technical Developments, vol. 7, Oct. 1987, pp. 22-23.
Iverson, "Next Generation Power Electronics for Space and Aircraft Part II--Packaging," Proceedings of the 26.sup.th Intersociety energy Conversion Engineering Conference, IECED -91, Aug. 4-9, 1991, pp. 177-182.
"Power Grid Image For Embedded Arrays," IBM Technical Disclosure Bulletin, Bol. 32, No. 8B, Jan. 1990.
Ken
Beilin Solomon I.
Chou William T.
Kudzuma David
Lee Michael G.
Moresco Larry L.
Fujitsu Limited
Luebke Renee
Patel T. C.
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